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sn74cbts16212 24-bit fet bus-exchange switch with schottky diode clamping scds036e ? december 1997 ? revised november 2001 1 post office box 655303 ? dallas, texas 75265 member of the texas instruments widebus ? family 5- ? switch connection between two ports ttl-compatible input levels latch-up performance exceeds 250 ma per jesd 17 esd protection exceeds jesd 22 ? 2000-v human-body model (a114-a) ? 200-v machine model (a115-a) description the sn74cbts16212 provides 24 bits of high-speed ttl-compatible bus switching or exchanging with schottky diodes on the i/os to clamp undershoot. the low on-state resistance of the switch allows connections to be made with minimal propagation delay. the device operates as a 24-bit bus switch or as a 12-bit bus exchanger that provides data exchanging between the four signal ports via the data-select (s0?s2) terminals. ordering information t a package ? orderable part number top-side marking ssop dl tube SN74CBTS16212DL cbts16212 40 cto85 c ssop ? dl tape and reel SN74CBTS16212DLr cbts16212 ? 40 c to 85 c tssop ? dgg tape and reel sn74cbts16212dggr cbts16212 tvsop ? dgv tape and reel sn74cbts16212dgvr cys212 ? package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. production data information is current as of publication date. products conform to specifications per the terms of texas instruments standard warranty. production processing does not necessarily include testing of all parameters. copyright ? 2001, texas instruments incorporated dgg, dgv, or dl package (top view) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 s0 1a1 1a2 2a1 2a2 3a1 3a2 gnd 4a1 4a2 5a1 5a2 6a1 6a2 7a1 7a2 v cc 8a1 gnd 8a2 9a1 9a2 10a1 10a2 11a1 11a2 12a1 12a2 s1 s2 1b1 1b2 2b1 2b2 3b1 gnd 3b2 4b1 4b2 5b1 5b2 6b1 6b2 7b1 7b2 8b1 gnd 8b2 9b1 9b2 10b1 10b2 11b1 11b2 12b1 12b2 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. widebus is a trademark of texas instruments.
sn74cbts16212 24-bit fet bus-exchange switch with schottky diode clamping scds036e ? december 1997 ? revised november 2001 2 post office box 655303 ? dallas, texas 75265 function table inputs inputs/outputs function s2 s1 s0 a1 a2 function l l l z z disconnect l lh b1 z a1 port = b1 port l hl b2 z a1 port = b2 port l hh z b1 a2 port = b1 port h ll z b2 a2 port = b2 port h lh z z disconnect h h l b1 b2 a1 port = b1 port a2 port = b2 port h h h b2 b1 a1 port = b2 port a2 port = b1 port
sn74cbts16212 24-bit fet bus-exchange switch with schottky diode clamping scds036e ? december 1997 ? revised november 2001 3 post office box 655303 ? dallas, texas 75265 logic diagram (positive logic) 12b2 12b1 1b2 1b1 12a2 12a1 1a2 1a1 s0 s1 s2 2 3 27 28 1 56 55 54 53 30 29
sn74cbts16212 24-bit fet bus-exchange switch with schottky diode clamping scds036e ? december 1997 ? revised november 2001 4 post office box 655303 ? dallas, texas 75265 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) ? supply voltage range, v cc ? 0.5 v to 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input voltage range, v i (see note 1) ? 0.5 v to 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous channel current 128 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input clamp current, i ik (v i < 0) ? 50 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . package thermal impedance, ja (see note 2): dgg package 64 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . dgv package 48 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . dl package 56 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . storage temperature range, t stg ? 65 c to 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ? stresses beyond those listed under ? absolute maximum ratings ? may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ? recommended operating conditions ? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. notes: 1. the input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observe d. 2. the package thermal impedance is calculated in accordance with jesd 51-7. recommended operating conditions (see note 3) min max unit v cc supply voltage 4 5.5 v v ih high-level control input voltage 2 v v il low-level control input voltage 0.8 v t a operating free-air temperature ? 40 85 c note 3: all unused control inputs of the device must be held at v cc or gnd to ensure proper device operation. refer to the ti application report, implications of slow or floating cmos inputs , literature number scba004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) parameter test conditions min typ ? max unit v ik v cc = 4.5 v, i i = ? 18 ma ? 1.2 v i i i il v cc = 5.5 v, v i = gnd ? 1 a i i i ih v cc = 5.5 v, v i = 5.5 v 150 a i cc v cc = 5.5 v, i o = 0, v i = v cc or gnd 3 a ? i cc control inputs v cc = 5.5 v, one input at 3.4 v, other inputs at v cc or gnd 2.5 ma c i control inputs v i = 3 v or 0 2.5 pf c io(off) v o = 3 v or 0, s0, s1, and s2 = gnd 10.5 pf ? v cc = 4 v, v i = 2.4 v, i i = 15 ma 20 r ? v i =0 i i = 64 ma 4 7 ? ? v cc = 4.5 v v i = 0 i i = 30 ma 4 7 ? ? all typical values are at v cc = 5 v, t a = 25 c. this is the increase in supply current for each input that is at the specified ttl voltage level rather than v cc or gnd. ? measured by the voltage drop between the a and b terminals at the indicated current through the switch. on-state resistance is determined by the lower of the voltages of the two (a or b) terminals.
sn74cbts16212 24-bit fet bus-exchange switch with schottky diode clamping scds036e ? december 1997 ? revised november 2001 5 post office box 655303 ? dallas, texas 75265 switching characteristics over recommended operating free-air temperature range, c l = 50 pf (unless otherwise noted) (see figure 1) parameter from (input) to (output) v cc = 4 v v cc = 5 v 0.5 v unit (input) (output) min max min max t pd ? a or b b or a 0.35 0.25 ns t pd s a or b 10 1.5 9.1 ns t en s a or b 10.4 1.5 9.7 ns t dis s a or b 9.2 1.5 8.8 ns ? the propagation delay is the calculated rc time constant of the typical on-state resistance of the switch and the specified loa d capacitance, when driven by an ideal voltage source (zero output impedance). parameter measurement information v oh v ol from output under test c l = 50 pf (see note a) load circuit s1 7 v open gnd 500 ? 500 ? t plh t phl output control output waveform 1 s1 at 7 v (see note b) output waveform 2 s1 at open (see note b) t pzl t pzh t plz t phz 3 v 0 v v oh v ol 0 v v ol + 0.3 v v oh ? 0.3 v 0 v input 3 v 3.5 v voltage waveforms propagation delay times voltage waveforms enable and disable times output t pd t plz /t pzl t phz /t pzh open 7 v open test s1 notes: a. c l includes probe and jig capacitance. b. waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. c. all input pulses are supplied by generators having the following characteristics: prr 10 mhz, z o = 50 ? , t r 2.5 ns, t f 2.5 ns. d. the outputs are measured one at a time with one transition per measurement. e. t plz and t phz are the same as t dis . f. t pzl and t pzh are the same as t en . g. t plh and t phl are the same as t pd . 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v figure 1. load circuit and voltage waveforms
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) 74cbts16212dggre4 active tssop dgg 56 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 74cbts16212dggrg4 active tssop dgg 56 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 74cbts16212dgvre4 active tvsop dgv 56 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 74cbts16212dgvrg4 active tvsop dgv 56 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 74cbts16212dlrg4 active ssop dl 56 1000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74cbts16212dggr active tssop dgg 56 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74cbts16212dgvr active tvsop dgv 56 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74CBTS16212DL active ssop dl 56 20 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74CBTS16212DLg4 active ssop dl 56 20 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74CBTS16212DLr active ssop dl 56 1000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 27-sep-2007 addendum-page 1
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant sn74cbts16212dggr tssop dgg 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 q1 sn74cbts16212dgvr tvsop dgv 56 2000 330.0 24.4 6.8 11.7 1.6 12.0 24.0 q1 SN74CBTS16212DLr ssop dl 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) sn74cbts16212dggr tssop dgg 56 2000 346.0 346.0 41.0 sn74cbts16212dgvr tvsop dgv 56 2000 346.0 346.0 41.0 SN74CBTS16212DLr ssop dl 56 1000 346.0 346.0 49.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2
mechanical data msso001c ? january 1995 ? revised december 2001 post office box 655303 ? dallas, texas 75265 dl (r-pdso-g**) plastic small-outline package 4040048 / e 12/01 48 pins shown 56 0.730 (18,54) 0.720 (18,29) 48 28 0.370 (9,40) (9,65) 0.380 gage plane dim 0.420 (10,67) 0.395 (10,03) a min a max 0.010 (0,25) pins ** 0.630 (16,00) (15,75) 0.620 0.010 (0,25) seating plane 0.020 (0,51) 0.040 (1,02) 25 24 0.008 (0,203) 0.0135 (0,343) 48 1 0.008 (0,20) min a 0.110 (2,79) max 0.299 (7,59) 0.291 (7,39) 0.004 (0,10) m 0.005 (0,13) 0.025 (0,635) 0 ? 8 0.005 (0,13) notes: a. all linear dimensions are in inches (millimeters). b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). d. falls within jedec mo-118
mechanical data mtss003d january 1995 revised january 1998 post office box 655303 ? dallas, texas 75265 dgg (r-pdso-g**) plastic small-outline package 4040078 / f 12/97 48 pins shown 0,25 0,15 nom gage plane 6,00 6,20 8,30 7,90 0,75 0,50 seating plane 25 0,27 0,17 24 a 48 1 1,20 max m 0,08 0,10 0,50 0 8 56 14,10 13,90 48 dim a max a min pins ** 12,40 12,60 64 17,10 16,90 0,15 0,05 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold protrusion not to exceed 0,15. d. falls within jedec mo-153
mechanical data mpds006c february 1996 revised august 2000 post office box 655303 ? dallas, texas 75265 dgv (r-pdso-g**) plastic small-outline 24 pins shown 14 3,70 3,50 4,90 5,10 20 dim pins ** 4073251/e 08/00 1,20 max seating plane 0,05 0,15 0,25 0,50 0,75 0,23 0,13 112 24 13 4,30 4,50 0,16 nom gage plane a 7,90 7,70 38 24 16 4,90 5,10 3,70 3,50 a max a min 6,60 6,20 11,20 11,40 56 9,60 9,80 48 0,08 m 0,07 0,40 0 8 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. d. falls within jedec: 24/48 pins mo-153 14/16/20/56 pins mo-194
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are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of ti information in ti data books or data sheets is permissible only if reproduction is without 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